Biren Technology · Data center · Module
Biren Bili 166M GPGPU module
Exact Bili 166M reference specifications and AI deployment guidance, separated from FusionPointAI commercial inventory.
Current
Reference only
Verified technical specifications
| Manufacturer | Biren Technology |
|---|---|
| Exact SKU | Bili 166M |
| Product family | Biren Technology Bili 166M |
| Architecture | Biren · Proprietary · GPGPU |
| Generation | Bili 166 |
| Entity type | Module |
| Lifecycle | Current |
| Launch date | The manufacturer has not published this information. |
| VRAM | 64 GB |
| Memory technology | The manufacturer has not published this information. |
| Memory bandwidth | 1,600 GB/s |
| Power | 550 W |
| Interface | OAM V1.1 |
| Form factor | 4U · Air cooled · OAM V1.1 · Module |
| Interconnect | The manufacturer has not published this information. |
| MIG / partitioning | Not supported |
| AI precision support | The manufacturer has not published this information. |
| Software stack | birensupa, pytorch, vllm, sglang, diffusers |
AI workload suitability
LLM inference
Best suited to smaller checkpoints, compressed models or distributed configurations sized by the recommendation engine.
Fine-tuning and training
Designed for sustained accelerator workloads; training suitability depends on interconnect, precision and cluster topology.
Image, video and embeddings
Confirm framework and precision support before deployment.
Power and cooling
550 W published power requires chassis, airflow and power delivery for this exact form factor.
Multi-GPU use
No dedicated accelerator interconnect is asserted from the available manufacturer evidence.
Software ecosystem
birensupa, pytorch, vllm, sglang, diffusers
Product timeline
Media gallery
Official manufacturer source
https://www.birentech.com/product/hardware/166m/
Last verified: 2026-08-27